SD NAND采用全球最小的 WSON-8 封装，体积相比传统 eMMC/SD 卡缩小约 70%，非常适用于智能手表、耳机等高集成度可穿戴设备。无外部接口设计，可直接焊接至 PCB，省去卡槽结构，抗震性能提升并确保工业应用中长期稳定。全密封三防结构具备防水、防尘、抗摔能力，可在极端户外环境下稳定运行。内置控制器与固件，支持标准 SD 2.0 协议及 SPI/SD 接口，无需额外驱动，即贴即用，显著降低开发成本与集成难度。

World’s smallest WSON-8 package — 70% smaller than traditional eMMC/SD cards.

Designed for wearables such as smartwatches and earbuds.

Direct PCB soldering — no card slot required.

Waterproof, dustproof, and shock-resistant.

Reliable performance in extreme environments.